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Categories Economy

Morse Micro Releases HaLowLink 2 Wi-Fi HaLow Platform

January 7, 2026

Key Insights (AI-assisted): HaLowLink 2’s general availability signals that Wi-Fi HaLow is moving from chipset sampling to deployable infrastructure for real-world IoT networks.

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Categories Economy

Telit Cinterion and Nokia Partner on Mission-Critical AI Connectivity

January 7, 2026

Key Insights (AI-assisted): By tightly coupling connectivity hardware with an AI-centric industrial platform, this partnership accelerates convergence between operational technology and advanced edge

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Categories Economy

Morse Micro Releases HaLowLink 2 Wi-Fi HaLow Platform

January 7, 2026

Morse Micro Announces General Availability of HaLowLink 2 at CES 2026 Morse Micro, the world’s leading provider of Wi-Fi HaLow semiconductors, today announced

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Categories Economy

Nordic Semiconductor brings edge AI to IoT devices

January 7, 2026

Key Insights (AI-assisted): Nordic’s move effectively collapses the stack between ultra‑low‑power connectivity silicon, ML tooling, and lifecycle cloud services. By embedding an NPU and

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Categories Economy

Quectel Launches NXP i.MX Wi-Fi 6 Modules for Entry-Level IoT Devices

January 6, 2026

Key Insights (AI-assisted): By tightly coupling NXP’s i.MX 9 compute with Wi‑Fi 6 and multi-protocol radios in an entry-level form factor, Quectel is

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Categories Economy

Sony Outlines Vision for 5G eRedCap as the Next Step in IoT Connectivity

January 6, 2026

Key Insights (AI-assisted): Sony’s positioning of eRedCap as the anchor for long-life 5G IoT signals that mid-tier cellular performance is becoming strategically more

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Categories Economy

Afero and Texas Instruments Partner to Build a Secure IoT Platform Designed for a Connected World

January 5, 2026

Key Insights (AI-assisted): This move signals a convergence between secure-by-design IoT software stacks and US-based semiconductor manufacturing for mass-market smart home deployments. By

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Categories Economy

Quectel Targets High-End Multimedia and Edge AI Applications with New SP895BD-AP Smart Module

January 5, 2026

Key Insights (AI-assisted): By pairing a 3nm application processor with a smart module form factor, Quectel is pushing smartphone-class compute and graphics deeper

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Categories Economy

eSIM + iSIM in 2026: Real Deployment Challenges That Vendors Don’t Advertise

January 5, 2026

Key Insights (AI-assisted): As eSIM and iSIM become default assumptions in IoT, the strategic bottleneck is shifting from hardware selection to operational maturity.

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Categories Economy

MultiTech Selects Sequans to Power Next-Generation Embedded Cellular Modem Platforms

January 5, 2026

Key Insights (AI-assisted): By anchoring on Cat 1bis now with a roadmap to 5G eRedCap, this partnership underscores how many industrial OEMs will

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