Quectel Unveils RG660QA and RG660QB 5G Modules
Key Insights (AI-assisted): This launch signals how 5G modules are evolving from pure connectivity components into integrated compute-and-connect platforms. Support for 24 TOPS,
Key Insights (AI-assisted): This launch signals how 5G modules are evolving from pure connectivity components into integrated compute-and-connect platforms. Support for 24 TOPS,
Key Insights (AI-assisted): HaLowLink 2’s general availability signals that Wi-Fi HaLow is moving from chipset sampling to deployable infrastructure for real-world IoT networks.
Key Insights (AI-assisted): By tightly coupling connectivity hardware with an AI-centric industrial platform, this partnership accelerates convergence between operational technology and advanced edge
Morse Micro Announces General Availability of HaLowLink 2 at CES 2026 Morse Micro, the world’s leading provider of Wi-Fi HaLow semiconductors, today announced
Key Insights (AI-assisted): Nordic’s move effectively collapses the stack between ultra‑low‑power connectivity silicon, ML tooling, and lifecycle cloud services. By embedding an NPU and
Key Insights (AI-assisted): By tightly coupling NXP’s i.MX 9 compute with Wi‑Fi 6 and multi-protocol radios in an entry-level form factor, Quectel is
Key Insights (AI-assisted): Sony’s positioning of eRedCap as the anchor for long-life 5G IoT signals that mid-tier cellular performance is becoming strategically more
Key Insights (AI-assisted): This move signals a convergence between secure-by-design IoT software stacks and US-based semiconductor manufacturing for mass-market smart home deployments. By
Key Insights (AI-assisted): By pairing a 3nm application processor with a smart module form factor, Quectel is pushing smartphone-class compute and graphics deeper
Key Insights (AI-assisted): As eSIM and iSIM become default assumptions in IoT, the strategic bottleneck is shifting from hardware selection to operational maturity.