Intel’s advanced chipmaking process reportedly runs into trouble

Intel’s chipmaking business may have run into a bit of a snag, as recent tests using the company’s next-gen manufacturing process have failed, according to Reuters.

To carry out the tests, Intel reportedly sent Broadcom’s silicon wafers — or the components used as a semiconductor’s base — through its more efficient 18A manufacturing process. After examining the results, Broadcom found that the process isn’t ready for high-volume production, Reuters reports.

The 18A process is a key part of Intel’s plan to reestablish itself as a leading chipmaker. Intel has been developing this technology for a few years now, and it plans to start producing chips using the process with major partners like Microsoft starting next year. However, the…

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